FlipChip International

FlipChip International (FCI) is a leading provider of advanced semiconductor packaging and wafer-level services, specializing in Wafer Level Chip Scale Packaging (WLCSP) and flip-chip bumping technologies. Headquartered in Phoenix, Arizona, the company provides high-reliability bumping and packaging solutions for the global semiconductor industry, including the automotive, consumer, and medical device sectors. FCI's technology is particularly relevant to the healthcare industry for the miniaturization of medical electronics such as hearing aids, pacemakers, and implantable sensors. The company offers a range of services including redistribution layers (RDL), copper pillar bumping, and thin-film processing. In April 2017, the company was acquired by Amkor Technology, one of the world's largest providers of outsourced semiconductor assembly and test (OSAT) services. Today, FCI operates as a key division within Amkor, continuing to drive innovation in miniaturized electronic components.